一 | 【TechWeb】知名半导体分析机构 SemiAnalysis 发布了对华为麒麟 9030 芯片的拆解报告。
二 | PHILADELPHIA -- Major U.S. pharmacy chain Rite Aid said Sunday that it has filed for bankruptcy and obtained $3.45 billion in fresh financing as it carries out a restructuring plan while coping with falling sales and opioid-related lawsuits. In 2022, Rite Aid settled for up to $30 million to resolve lawsuits alleging pharmacies contributed to an oversupply of prescription opioids. It said it had reached an agreement with its creditors on a financial restructuring plan to cut its debt and position itself for future growth and that the bankruptcy filing was part of that process. The plan will “significantly reduce the company's debt” while helping to “resolve litigation claims in an equitable manner,” Rite Aid said. In March, the Justice Department filed a complaint against Rite Aid, alleging it knowingly filled hundreds of thousands of unlawful prescriptions for controlled substances from May 2014-June 2019. It also accused pharmacists and the company of ignoring “red flags” indicating the prescriptions were illegal.The Justice Department acted after three whistleblowers who had worked at Rite Aid pharmacies filed a complaint. Jeffrey Stein, who heads a financial advisory firm, was appointed Rite Aid's CEO as of Sunday, replacing Elizabeth Burr, who was interim CEO and remains on Rite Aid's board. Earlier this month, Rite Aid notified the New York Stock Exchange that it was not in compliance with listing standards. During a grace period, the company's stock continues to be listed and traded. The bankruptcy filing in New Jersey and noncompliance with listing standards would not affect the company’s business operations or its U.S. Securities and Exchange Commission reporting requirements, it said. Rite Aid said it was arranging for payment of wages and other costs as usual, though some “underperforming” stores among its more than 2,100 pharmacies in 17 states will be closed. It earlier reported that its revenue fell to $5.7 billion in the fiscal quarter that ended June 3, down from $6.0 billion a year earlier, logging a net loss of $306.7 million.。报告显示，这颗由中芯国际（SMIC）代工的芯片，其最小金属间距（metal pitch）达到 32.5nm，比 Intel 最新的 18A 工艺 Panther Lake 的 36nm 还要大约 10%。更关键的是，这家中国晶圆厂是在无法获得最先进 EUV 光刻机的情况下，通过 DUV 多重 patterning 和设计-工艺协同优化（DTCO）达到这一密度水平。 一颗“金属间距比 Intel 18A 更小”的中国芯片 SemiAnalysis 的拆解指出，麒麟 9030 采用 SMIC 的 N+3 工艺（第三代 7nm 级节点），其 M0 局部金属层间距为 32.5nm，而 Intel 18A 的 M0 间距为 36nm。这意味着在最细金属线宽这一指标上，SMIC N+3 已比 Intel 最新一代逻辑节点更“紧凑”。 不过，报告也强调，金属间距只是衡量制程能力的指标之一，并不能代表整体工艺水平。SMIC N+3 的晶体管密度约 113.4 MTr/mm²，略高于 TSMC N6 的 107.7 MTr/mm²，但仍明显落后于 Intel 18A 的高密度库。
三 | 没有 EUV，如何做到更密金属层？ 在 EUV 光刻机被出口管制限制的背景下，SMIC N+3 并没有“等 EUV 可用”才开始推进先进制程。SemiAnalysis 的分析显示： SMIC 通过“DUV 浸没式 + 自对准四重图形（SAQP）”等高复杂度工艺，实现与 TSMC N6 相当的逻辑密度，但代价是工序更多、成本更高、控制难度更大。报告明确提到，即便没有 EUV，SMIC 仍达到甚至超过了一些使用 EUV 的成熟节点（如 TSMC N6）的密度水平。 这回答了 SemiAnalysis 提出的那个关键问题：在 EUV 不可得的前提下，中国芯片制造到底走到了哪一步？——至少从金属间距和局部密度看，它已经逼近甚至某些指标上“咬住”了最新一代制程。 金属更密 ≠ 整体领先 SemiAnalysis 同时强调，“金属间距更小”的标题很抓眼球，但并不等同于工艺整体领先： 在晶体管密度、性能、功耗等综合指标上，SMIC N+3 仍落后于 Intel 18A、TSMC N3P 等最先进节点。高密度是通过更复杂的 DUV 多重图形、更严苛的设计规则和工艺控制“换”来的，这在良率和成本上带来额外挑战。
四 | 报告指出，麒麟 9030 的整体性能大致相当于三年前的 Android 旗舰 SoC，与当前苹果、高通、联发科、三星的最新旗舰仍有明显差距。
五 | 对先进制程竞争格局的启示 这次拆解再次说明，先进半导体竞争比“有没有 EUV”的简单二元判断更复杂：在没有 EUV 的条件下，SMIC 通过 DTCO、SAQP 等手段，仍然把金属层密度推进到接近甚至部分指标优于 Intel 18A 的水平。这意味着出口管制改变了问题的难度，但并未完全冻结中国先进制程的演进路径。
六 | 同时，从性能、功耗、良率等多维度看，SMIC 与全球最领先工艺之间仍有明显差距，中国在整体生态、EDA、材料与设备等方面仍面临“追赶之路”。
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Published on:03:01:06
